Answer ( 1 )

  1. Miki
    0
    January 17, 2020 at 9:33 AM

    The BOM generally comes from the schematic capture process. Each component must have a part number associated with it in the component library. Once the schematic is complete, there is a process that produces a BOM, giving the part number, quantity, and reference designation. There are usually components that do not appear on the schematic, such as mounting hardware, heat sinks, sockets, and other mechanical parts. I use a separate manually generated list of these components, which are then merged with the schematic BOM to produce the final BOM. Some CAD packages will produce a spreadsheet as well.

    Library maintenance is a large part of the design process. Even a simple resistor may have different part numbers depending on the preferred manufacturer.

    This video details the operation of generating a BOM list on Eagle.https://www.youtube.com/watch?v=I0kMgWniZT8

    Although the production of PCB BOM is not a technical task, it is also very important for the smooth commissioning and production of products and projects. Now sort out the basic BOM design specifications.

    BOM required title

    Generally speaking, device parameters (models), device descriptions, packages, tag numbers, quantities, and remarks are needed. If you need to deliver to procurement, you also need the material number, brand, and so on.

    BOM collation

    The overall order generally arranges all components in the order of resistance, capacitance, inductance, diode, triode, IC, connector, and others.
    1. Resistor sequencing method: The resistors are arranged internally from small to large. Special resistors need to be marked.
    2. Capacitor sequencing method: Capacitors need to be classified into capacitors (stacked capacitors, tantalum capacitors, electrolytic capacitors, etc.), and the electrical values ​​are arranged in ascending order within the classification. Special capacitors need to be marked.
    3. Inductor sequencing method: Inductors need to be classified into inductors (laminated inductors, winding inductors, power inductors, etc.). The inductor values ​​are arranged from small to large within the classification. Special inductors need to be marked.
    4. IC arrangement method: Generally, it can be arranged from small to large according to the order of the bit numbers.
    5. Connectors: Connectors need to be classified inside the connector, and then sorted by small to large within the classification.
    Other devices should also be sorted by category, and then sorted by small to large within the classification.
    Don’t forget to add information such as the title of the form.

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